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Flow soldering is the most common method of attaching surface mount components to a circuit board. The goal of the Flow process is to melt the solder and heat the adjoining surfaces, without overheating and damaging the electrical components. In the conventional Flow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), flow or reflow, and cooling.

Soldering & Micro Soldering Rework

All Types Of Rework Undertaken

Hot Air Rework Station

Chip Migration

Rework on PS3 Daughter Board

We PCB Rework

Rework Nokia Mobile

Click to Expand ITE ECC with Repaired Traces

ITE ECC Trace Rework

Chip Migration We PCB Rework

Standard Soldering Rework

All Types Of Rework Undertaken

PS4 HDMI Socket Rework

Click to Expand Panasonic QFN HDMI Scaler

PS4 HDMI Scalier Rework

We PCB Rework

PS4 HDMI Pad Tint

iPhone 6 Rework on U2 IC

We offer Standard Soldering Iron Rework, Micro Soldering, Re-Flowing and Re-Balling on all Printed Circuit Boards from motherboards, engine management unit boards for car’s, bikes and all electrical or electronic devices in your home or at work. just bring the device with or without the new or damaged component that needs replacing, it’s that simple.

Chick to Expand PS4 APU BGA Site

PS4 1st Gen APU Re-Ball Rework

Click to Expand Xbox 360s Re-Ball

Xbox Re-Ball Rework

Click to Expand Failed Solder Mask BGA Site

Failed Solder Mask on BGA Site

Chick to Expand Xbox One Input / Output HDMI Sockets

Xbox One Twin HDMI Ports

Click to Expand Xbox One Socket Replacement Rework

Xbox One HDMI Port Repair

Click to Expand Failed Solder Mask BGA Site

Asus DC Socket Replacement

We Flow & Reball Most Chips Click to Expand

Tech on PS4 APU Reflow

Chick to Expand PS4 HDMI Socket Re-Trace Due to Broken Pad's

PS4 HDMi Re-Trace & Mask

PS4 APU and BGA Site on Main Board

PS4 APU with BGA Site

Click to Expand Bridged Balling on South Bridge IC

Bridged Balling Under IC